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The two-day conference aims to equip delegates with in-depth knowledge, as well as strategic insights into how they can help move the sector forward.
February 12, 2020
By: Greg Hrinya
Editor
A host of speakers representing well-known brands and top label and package printing stakeholders are coming together to take part in the forthcoming Label Summit Latin America 2020, which returns to Santiago, Chile. Taking place between March 10-11 at Espacio Riesco Convention Center, the two-day conference aims to equip delegates with in-depth knowledge, as well as strategic insights into how they can help move the sector forward in Chile and the wider region. The conference program has been designed with a strong business and strategy theme throughout. The key focus for day one will be business markets and opportunities, while day two will focus on packaging, design and branding. Leading the first conference session on day one is Mariana Soto Urzúa, general manager, CENEM, who will give a presentation on key market trends and sectors in Chile and the Southern Cone. This will be followed by a session led by Javier Ibero Arimany, LATAM manager for EADEC Chile, who will speak on sustainability and the circular economy in the region and how companies can address this concern. Further day one highlights include a keynote presentation from gold sponsor GlobalQuality.space’s business development manager, Askold Zimmermann, on workflow automation and quality control for converters and brand owners. Business diversification is the afternoon’s topic, with a session from Ignacio Ramos, commercial director at converter R&R Impresores, who will share how the company has expanded its printing business into packaging and labels. He will also join the final session of the day: a converter panel discussion on new areas of investment and using competitive pressure to your advantage. Fellow panelist includes Jorge Garrido, director, Garino Hnos. Day two will open with a presentation from James Quirk, Labels & Labeling magazine editor, who will provide an insight into global label and packaging trends. Further day two highlights include a session on designing packaging that sells, led by Luis Arevalo, packaging engineering director, Latin America, Kellogg Company. Speaking at his fifth Label Summit Latin America, Hernán Braberman, partner and executive design director, Tridimage, will show delegates how to design products for different markets, ranging from Baby Boomers to Millennials and Generation Z. The focus of the afternoon will be on label design and combating counterfeiting. Ignacio Zermeño, commercial director, MGM México – Witte Group, will give delegates insight into increasing sophistication in labeling, while a panel discussion on wine labeling will expand on this and conclude the conference. An exposition from leading manufacturers will complement the conference program, with 70 industry suppliers showcasing the latest products and technological advancements. Jessika Bustamante Meisner, Label Summit Latin America 2020 event manager, comments, “We are delighted to welcome such a prestigious lineup of speakers for this year’s Label Summit Latin America in Chile. Our aims in putting together the topical conference program are to provide delegates with exclusive insight into current and future industry trends, enable them to discover how they can take advantage of these in their respective businesses, and inspire them to continue playing an important part in driving forward the dynamic label and package printing industry in Chile and the wider region.” Hernán Braberman adds, “This will be my fifth participation as a speaker at Label Summit Latin America, which is, without a doubt, the main event in the region for the label and packaging industry. I find it inspiring to be able to dialogue with brand owners, converters, suppliers of raw materials, equipment and machinery and design agencies. Together we have the mission to imagine and build a bright future for the label and packaging industry in Latin America.” An early bird attendee rate is valid until February 21.
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